Calendar

Week Monday Tuesday Wednesday Thursday Friday
1/20
First class meeting 4:00p - 5:50p ECEB 1002
1/27
Second class meeting 4:00p - 5:50p ECEB 1002
CAD assignment due 11:59p
2/3
Add/Drop Deadline due 11:59p
Third class meeting 4:00p - 5:50p ECEB 1002
Project approval due 11:59p
2/10
First team meetings with TAs 4:00p ECEB 3081
Proposals due 11:59p
Initial Conversation With Machine Shop (required if using the shop) due 4:00p ECEB 1047
Team Contract due 11:59p
Proposal Review Sign-up due 11:59p
2/17
Proposal Review 8:00a - 6:00p With Instructor and TAs
Design Review
Fliflet: 2070
Design Review
Gruev: 2074
Design Review
Oelze: 5086
Proposal Review 8:00a - 6:00p With Instructor and TAs
Design Review
Fliflet: 2070
Design Review
Zhao: 2072
Design Review
Gruev: 2074
Design Review
Oelze: 5086
Proposal Review 8:00a - 6:00p With Instructor and TAs
Design Review
Fliflet: 2070
Design Review
Zhao: 2072
Design Review
Gruev: 2074
Design Review
Oelze: 5086
2/24
PCB Review 3:00p - 5:00p ECEB 3081
3/3
Design Document due 11:59p
3/10
Breadboard Demo 8:00a - 6:00p WIth Instructor and TA
Breadboard Demonstration
Fliflet: 2070
Breadboard Demonstration
Oelze: 2070
Breadboard Demonstration
Zhao: 2072
Breadboarrd Demo 8:00a - 6:00p With Instructor and TA
Breadboard Demonstration
Fliflet: 2070
Breadboard Demonstration
Oelze: 2070
Breadboard Demonstration
Zhao: 2072
Breadboard Demonstration
Gruev: 2074
Breadboard Demo 8:00a - 6:00p With Instructor and TA
Breadboard Demonstration
Fliflet: 2070
Breadboard Demonstration
Oelze: 2070
Breadboard Demonstration
Zhao: 2072
Breadboard Demonstration
Gruev: 2074
Last day for revisions to the machine shop due ECEB 1048
3/17
Spring Break
Spring Break
Spring Break
Spring Break
Spring Break
3/24
3/31
4/7
4/14
4/21
Mock demo During weekly TA mtg
Mock demo During weekly TA mtg
Mock demo During weekly TA mtg
Mock demo During weekly TA mtg
Mock demo During weekly TA mtg
4/28
Final Demo With Instructor and TAs
Demonstration
Fliflet: ECEB 2070
Demonstration
Gruev: ECEB 2070
Demonstration
Oelze: ECEB 2070
Demonstration
Zhao: ECEB 2072
Final Demo With Instructor and TAs
Demonstration
Fliflet: ECEB 2070
Demonstration
Gruev: ECEB 2070
Demonstration
Oelze: ECEB 2070
Demonstration
Zhao: ECEB 2072
Final Demo With Instructor and TAs
Demonstration
Fliflet: ECEB 2070
Demonstration
Gruev: ECEB 2070
Mock Presentation With Comm and ECE TAs
Mock Presentation With Comm and ECE TAs
Extra Credit Video Assignment due 11:59p
5/5
Final Presentation With instructor and TAs
Presentation
Fliflet: ECEB 2070
Presentation
Zhao: ECEB 2072
Presentation
Gruev: ECEB 2074
Presentation
Oelze: ECEB 5086
Final Presentation With Instructor and TAs
Presentation
Fliflet: ECEB 2070
Presentation
Gruev: ECEB 2074
Presentation
Oelze: ECEB 5086
Final papers due 11:59p
Lab checkout 3:00p - 4:30p With TA
Award Ceremony 4:30p - 5:30p ECEB 3002
Lab Notebook Due due 11:59p
5/12
5/19
5/26
6/2
Presentation
Zhao: ECEB 2072

Four Point Probe

Simon Danthinne, Ming-Yan Hsiao, Dorian Tricaud

Four Point Probe

Featured Project

# Four Point Probe

Team Members:

Simon Danthinne(simoned2)

Ming-Yan Hsiao(myhsiao2)

Dorian Tricaud (tricaud2)

# Problem:

In the manufacturing process of semiconductor wafers, numerous pieces of test equipment are essential to verify that each manufacturing step has been correctly executed. This requirement significantly raises the cost barrier for entering semiconductor manufacturing, making it challenging for students and hobbyists to gain practical experience. To address this issue, we propose developing an all-in-one four-point probe setup. This device will enable users to measure the surface resistivity of a wafer, a critical parameter that can provide insights into various properties of the wafer, such as its doping level. By offering a more accessible and cost-effective solution, we aim to lower the entry barriers and facilitate hands-on learning and experimentation in semiconductor manufacturing.

# Solution:

Our design will use an off-the-shelf four point probe head for the precision manufacturing tolerances which will be used for contact with the wafer. This wafer contact solution will then be connected to a current source precisely controlled by an IC as well as an ADC to measure the voltage. For user interface, we will have an array of buttons for user input as well as an LCD screen to provide measurement readout and parameter setup regarding wafer information. This will allow us to make better approximations for the wafer based on size and doping type.

# Solution Components:

## Subsystem 1: Measurement system

We will utilize a four-point probe head (HPS2523) with 2mm diameter gold tips to measure the sheet resistance of the silicon wafer. A DC voltage regulator (DIO6905CSH3) will be employed to force current through the two outer tips, while a 24-bit ADC (MCP3561RT-E/ST) will measure the voltage across the two inner tips, with expected measurements in the millivolt range and current operation lasting several milliseconds. Additionally, we plan to use an AC voltage regulator (TPS79633QDCQRQ1) to transiently sweep the outer tips to measure capacitances between them, which will help determine the dopants present. To accurately measure the low voltages, we will amplify the signal using an JFET op-amp (OPA140AIDGKR) to ensure it falls within the ADC’s specifications. Using these measurements, we can apply formulas with corrections for real-world factors to calculate the sheet resistance and other parameters of the wafer.

## Subsystem 2: User Input

To enable users to interact effectively with the measurement system, we will implement an array of buttons that offer various functions such as calibration, measurement setup, and measurement polling. This interface will let users configure the measurement system to ensure that the approximations are suitable for the specific properties of the wafer. The button interface will provide users with the ability to initiate calibration routines to ensure accuracy and reliability, and set up measurements by defining parameters like type, range, and size tailored to the wafer’s characteristics. Additionally, users can poll measurements to start, stop, and monitor ongoing measurements, allowing for real-time adjustments and data collection. The interface also allows users to make approximations regarding other wafer properties so the user can quickly find out more information on their wafer. This comprehensive button interface will make the measurement system user-friendly and adaptable, ensuring precise and efficient measurements tailored to the specific needs of each wafer.

## Subsystem 3: Display

To provide output to users, we will utilize a monochrome 2.4 inch 128x64 OLED LCD display driven over SPI from the MCU. This display will not only present data clearly but also serve as an interface for users to interact with the device. The monochrome LCD will be instrumental in displaying measurement results, system status, and other relevant information in a straightforward and easy-to-read format. Additionally, it will facilitate user interaction by providing visual feedback during calibration, measurement setup, and polling processes. This ensures that users can efficiently navigate and operate the device, making the overall experience intuitive and user-friendly.

# Criterion for Success:

A precise constant current can be run through the wafer for various samples

Measurement system can identify voltage (10mV range minimum) across wafer

Measurement data and calculations can be viewed on LCD

Button inputs allow us to navigate and setup measurement parameters

Total part cost per unit must be less than cheapest readily available four point probes (≤ 650 USD)

Project Videos