Project
| # | Title | Team Members | TA | Documents | Sponsor |
|---|---|---|---|---|---|
| 51 | Easy Bake PCB's |
Bhaven Shah Raghav Narasimhan Zak Kaminski |
Prannoy Kathiresan | design_document3.pdf final_paper1.pdf photo1.jpg photo2.jpg presentation1.pptx proposal3.pdf video |
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| # Easy Bake PCB's Team Members: - Bhaven Shah (bhaven2) - Zak Kaminski (zak5) - Raghav Narasimhan (rnn3) # Problem Often for my RSO, Illini Solar Car, we have to hand solder very small SMD components such as 0603 or even 0402 imperial codes. This often leads to failures on our boards as solder joints fail causing the entire board to short. This negatively affects our team’s performance during our races as we then have to repair the car by finding the source of the issue and then replacing that board. This costs us valuable time in our race as we want to be driving every possible second we are allowed to keep us competitive. Soldering is also a skilled activity, meaning many hours are required to become proficient. These are hours students are losing to work on other projects or school work. Having a reflow oven would save many hours of labor which can be used for design reviews or designing new PCBs. # Solution Our solution is to build a custom reflow oven by converting a toaster oven. While this is an item that you can commercially purchase off the shelf, it is not something that our team can fully justify the cost of as good reflow ovens can cost north of $300 USD. Also there are a couple of commercially available products that you can purchase to modify your toaster oven, but they are never in stock to purchase. As there is a parts shortage, we will have to design our own conversion kit that can be built with readily available components. Our reflow oven will also include an alert system that utilizes video to determine if a component has slid out of place. This is something that current commercially available reflow ovens do not include and will be cheap enough that even enthusiasts could build one themselves. # Solution Components ## Subsystem 1 - Thermocouple: https://www.adafruit.com/product/269 https://www.digikey.com/en/products/base-product/maxim-integrated/175/MAX31855/82847 The thermocouple system will be used to continually monitor the temperature inside of the toaster oven. Temperature is critical when soldering and ensuring that you have the right temperature will provide excellent results as the Joint Electron Device Engineering Council (JEDEC) Solid State Technology Association has published documentation on “profiles” for reflow soldering that require precise temperatures. ## Subsystem 2 - Camera: The camera subsystem will be added to constantly monitor the reflow process. It will be a check that ensures that no components are moving during the process causing bad joints to be formed and will immediately stop if it detects that a component has moved too far from its original position. ## Subsystem 3 - Heating & Fan Control: It is extremely important to use a heating device that produces precise changes in temperature and responds quickly to desired changes in temperature. The fan is also important to not allow the components to overheat. ## Subsystem 4 - Touchscreen: Used for easy user interaction with the reflow oven in order to set the user’s desired temperature and duration as well as to give visual feedback to the user. ## Subsystem 5 - Power Supply: Wall outlet and will be converted to the desired range for the on-system chips. ## Subsystem 6 - Microcontroller: Will take in the temperature and camera data to determine when to turn on or off the fans, when to increase or decrease the temperature in the reflow oven, and alert when the components move in an undesirable fashion. It will also control the touchscreen. # Criterion For Success * Reflow solder PCBs with 10% margin of error * Detect when a component covers less than 70% of the pad and alert the user (further testing required to determine how far a component is allowed to move and still be viable) |
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