Final Presentation

Description

Presentations of the projects are given a few days after the Final Demo to an audience of fellow student reviewers, the lab instructors, and occasionally faculty or even students from outside the class who are following up a project of personal interest to them. The style is formal and professional, and students should dress accordingly (Generally business professional, or what you would wear to a career fair).

Requirements and Grading

Each project team has 25 minutes for a Powerpoint presentation and questions. Every group member must present their own work contributing to the project and be ready to answer questions. Presentations are judged on the basis of presentation technique and of technical organization and content.

Presentation technique includes dress, use of display materials (slides), clarity of speech, absence of filler words/fidgeting, proper eye contact with audience and smooth transitions between speakers. Content is judged on use of a proper introduction, orderly and connected development of ideas, absence of unnecessary details, proper pacing to stay within the allotted time, and an adequate summary at the close of the talk. Quantitative results are expected whenever applicable. Here is a general outline to follow:

  1. Introduction to your team and your project.
  2. Objective. What problem are you solving?
  3. Brief review of original design, statement on areas of design that changed, and overview of each functional block's requirements.
  4. Description of project build and functional test results. You can choose to include a short (30s) video of your project here.
  5. Discussion of successes and challenges, as well as explanations of any failed verifications demonstrating and understanding of the engineering reason behind the failure
  6. Conclusions from the project: what did you learn, what would you do differently if you redesigned your project, etc.
  7. Recommendations for further work.

Any significant, relevant ethical issues should be briefly addressed, preferably in a single slide.

Presentations will be graded using the presentation grading rubric. Your slides should follow ECE or College of Engineering presentation theming.

Submission and Deadlines

Slides for your final presentation must be uploaded to your project page on PACE prior to your presentation time. Deadlines for signing up may be found on the Calendar. Sign-up for the final presentation is done through PACE. Remember to sign up for a peer review of another group.

Four Point Probe

Simon Danthinne, Ming-Yan Hsiao, Dorian Tricaud

Four Point Probe

Featured Project

# Four Point Probe

Team Members:

Simon Danthinne(simoned2)

Ming-Yan Hsiao(myhsiao2)

Dorian Tricaud (tricaud2)

# Problem:

In the manufacturing process of semiconductor wafers, numerous pieces of test equipment are essential to verify that each manufacturing step has been correctly executed. This requirement significantly raises the cost barrier for entering semiconductor manufacturing, making it challenging for students and hobbyists to gain practical experience. To address this issue, we propose developing an all-in-one four-point probe setup. This device will enable users to measure the surface resistivity of a wafer, a critical parameter that can provide insights into various properties of the wafer, such as its doping level. By offering a more accessible and cost-effective solution, we aim to lower the entry barriers and facilitate hands-on learning and experimentation in semiconductor manufacturing.

# Solution:

Our design will use an off-the-shelf four point probe head for the precision manufacturing tolerances which will be used for contact with the wafer. This wafer contact solution will then be connected to a current source precisely controlled by an IC as well as an ADC to measure the voltage. For user interface, we will have an array of buttons for user input as well as an LCD screen to provide measurement readout and parameter setup regarding wafer information. This will allow us to make better approximations for the wafer based on size and doping type.

# Solution Components:

## Subsystem 1: Measurement system

We will utilize a four-point probe head (HPS2523) with 2mm diameter gold tips to measure the sheet resistance of the silicon wafer. A DC voltage regulator (DIO6905CSH3) will be employed to force current through the two outer tips, while a 24-bit ADC (MCP3561RT-E/ST) will measure the voltage across the two inner tips, with expected measurements in the millivolt range and current operation lasting several milliseconds. Additionally, we plan to use an AC voltage regulator (TPS79633QDCQRQ1) to transiently sweep the outer tips to measure capacitances between them, which will help determine the dopants present. To accurately measure the low voltages, we will amplify the signal using an JFET op-amp (OPA140AIDGKR) to ensure it falls within the ADC’s specifications. Using these measurements, we can apply formulas with corrections for real-world factors to calculate the sheet resistance and other parameters of the wafer.

## Subsystem 2: User Input

To enable users to interact effectively with the measurement system, we will implement an array of buttons that offer various functions such as calibration, measurement setup, and measurement polling. This interface will let users configure the measurement system to ensure that the approximations are suitable for the specific properties of the wafer. The button interface will provide users with the ability to initiate calibration routines to ensure accuracy and reliability, and set up measurements by defining parameters like type, range, and size tailored to the wafer’s characteristics. Additionally, users can poll measurements to start, stop, and monitor ongoing measurements, allowing for real-time adjustments and data collection. The interface also allows users to make approximations regarding other wafer properties so the user can quickly find out more information on their wafer. This comprehensive button interface will make the measurement system user-friendly and adaptable, ensuring precise and efficient measurements tailored to the specific needs of each wafer.

## Subsystem 3: Display

To provide output to users, we will utilize a monochrome 2.4 inch 128x64 OLED LCD display driven over SPI from the MCU. This display will not only present data clearly but also serve as an interface for users to interact with the device. The monochrome LCD will be instrumental in displaying measurement results, system status, and other relevant information in a straightforward and easy-to-read format. Additionally, it will facilitate user interaction by providing visual feedback during calibration, measurement setup, and polling processes. This ensures that users can efficiently navigate and operate the device, making the overall experience intuitive and user-friendly.

# Criterion for Success:

A precise constant current can be run through the wafer for various samples

Measurement system can identify voltage (10mV range minimum) across wafer

Measurement data and calculations can be viewed on LCD

Button inputs allow us to navigate and setup measurement parameters

Total part cost per unit must be less than cheapest readily available four point probes (≤ 650 USD)

Project Videos