Course Websites
ME 598 ECO - Electronics Cooling
Last offered Fall 2024
Official Description
Subject offerings of new and developing areas of knowledge in mechanical engineering intended to augment the existing curriculum. See Class Schedule or departmental course information for topics and prerequisites. Course Information: May be repeated in the same or separate terms if topics vary.
Section Description
Section reserved for Online students
Introduction to microelectronics packaging from chip to system levels and the
challenging thermal issues. Introducing concepts such as junction temperature, heat
flux density and Moore?s Law.
Fundamentals of various heat transfer modes and fluid mechanics with applications to
microelectronics cooling systems.
Related Faculty
Subject Area
- Mechanical Science and Engineering
Course Description
This course covers:
- Introduction to microelectronics packaging from chip to system levels and the challenging thermal issues. Introducing concepts such as junction temperature, heat flux density and Moore’s Law.
- Fundamentals of various heat transfer modes and fluid mechanics with applications to microelectronics cooling systems.
- Thermal design of microelectronics systems:
- Air cooling
- Liquid cooling
- Two-phase cooling
- Other advanced cooling systems
- Thermal design of microelectronics systems with heat pipe technology:
- Heat pipe theory & design
- Heat pipe manufacturing
- Heat pipe applications in microelectronics cooling systems
- Other advanced electronics cooling technologies:
- Loop heat pipe
- Loop thermosyphon
- Pulsating heat pipe
Credit Hours
4 hours
Prerequisites
Undergraduate degree as well as ME310 and ME320.
| Title | Section | CRN | Type | Hours | Times | Days | Location | Instructor |
|---|---|---|---|---|---|---|---|---|
| Electronics Cooling | ECO | 32264 | ONL | 4 | - | L. Winston Zhang |