Course Websites

ME 598 ECO - Electronics Cooling

Last offered Fall 2022

Official Description

Subject offerings of new and developing areas of knowledge in mechanical engineering intended to augment the existing curriculum. See Class Schedule or departmental course information for topics and prerequisites. Course Information: May be repeated in the same or separate terms if topics vary.

Section Description

Section reserved for Online students Introduction to microelectronics packaging from chip to system levels and the challenging thermal issues. Introducing concepts such as junction temperature, heat flux density and Moore?s Law. Fundamentals of various heat transfer modes and fluid mechanics with applications to microelectronics cooling systems.

Subject Area

  • Mechanical Science and Engineering

Course Description

This course covers:

  • Introduction to microelectronics packaging from chip to system levels and the challenging thermal issues. Introducing concepts such as junction temperature, heat flux density and Moore’s Law.
  • Fundamentals of various heat transfer modes and fluid mechanics with applications to microelectronics cooling systems.
  • Thermal design of microelectronics systems:
    • Air cooling
    • Liquid cooling
    • Two-phase cooling
    • Other advanced cooling systems
  • Thermal design of microelectronics systems with heat pipe technology:
    • Heat pipe theory & design
    • Heat pipe manufacturing
    • Heat pipe applications in microelectronics cooling systems
  • Other advanced electronics cooling technologies:
    • Loop heat pipe
    • Loop thermosyphon
    • Pulsating heat pipe

Credit Hours

4 hours

Prerequisites

Undergraduate degree as well as ME310 and ME320.

TitleSectionCRNTypeHoursTimesDaysLocationInstructor
Electronics CoolingECO32264ONL4 -