Course Websites

ME 598 ECC - Electronics Cooling

Last offered Fall 2022

Official Description

Subject offerings of new and developing areas of knowledge in mechanical engineering intended to augment the existing curriculum. See Class Schedule or departmental course information for topics and prerequisites. Course Information: May be repeated in the same or separate terms if topics vary.

Section Description

Section reserved for students designated as On Campus Introduction to microelectronics packaging from chip to system levels and the challenging thermal issues. Introducing concepts such as junction temperature, heat flux density and Moore?s Law. Fundamentals of various heat transfer modes and fluid mechanics with applications to microelectronics cooling systems.

Related Faculty

Electronics CoolingECC77751ONL4 -    Lizheng W Zhang