Course Websites

ME 598 EC1 - Electronics Cooling

Last offered Fall 2024

Official Description

Subject offerings of new and developing areas of knowledge in mechanical engineering intended to augment the existing curriculum. See Class Schedule or departmental course information for topics and prerequisites. Course Information: May be repeated in the same or separate terms if topics vary.

Section Description

Introduction to microelectronics packaging from chip to system levels and the challenging thermal issues. Introducing concepts such as junction temperature, heat flux density and Moore?s Law. Fundamentals of various heat transfer modes and fluid mechanics with applications to microelectronics cooling systems.

Related Faculty

Electronics CoolingEC140066LCD41500 - 1650 M W  2018 Campus Instructional Facility L. Winston Zhang