ME 598 EC1 - Electronics Cooling
Last offered Fall 2023
Subject offerings of new and developing areas of knowledge in mechanical engineering intended to augment the existing curriculum. See Class Schedule or departmental course information for topics and prerequisites. Course Information: May be repeated in the same or separate terms if topics vary.
Introduction to microelectronics packaging from chip to system levels and the challenging thermal issues. Introducing concepts such as junction temperature, heat flux density and Moore?s Law. Fundamentals of various heat transfer modes and fluid mechanics with applications to microelectronics cooling systems.