Course Websites
ME 598 EC1 - Electronics Cooling
Last offered Fall 2022
Official Description
Subject offerings of new and developing areas of knowledge in mechanical engineering intended to augment the existing curriculum. See Class Schedule or departmental course information for topics and prerequisites. Course Information: May be repeated in the same or separate terms if topics vary.
Section Description
Introduction to microelectronics packaging from chip to system levels and the
challenging thermal issues. Introducing concepts such as junction temperature, heat
flux density and Moore?s Law.
Fundamentals of various heat transfer modes and fluid mechanics with applications to
microelectronics cooling systems.
Related Faculty
Title | Section | CRN | Type | Hours | Times | Days | Location | Instructor |
---|---|---|---|---|---|---|---|---|
Electronics Cooling | EC1 | 40066 | LCD | 4 | 1500 - 1650 | T R | 410B1 Engineering Hall | L. Winston Zhang |